Informations à l'usage du concepteur: Nickelage chimique = Informations for users: chemical nickel platingLACOURCELLE, L.Galvano organo traitements de surface. 1991, Vol 60, Num 614, pp 203-206, issn 0982-7870, 4 p.Article

Marktübersicht : Bäder und Verfahren zum Metallisieren : Daten aus einer schriftlichen Befragung der AnbieterCAPELLE, D.Metalloberfläche. 1990, Vol 44, Num 12, pp 579-600, issn 0026-0797, 22 p.Article

Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper filmBARBOSA, L. L; DE ALMEIDA, M. R. H; CARLOS, R. M et al.Surface & coatings technology. 2005, Vol 192, Num 2-3, pp 145-153, issn 0257-8972, 9 p.Article

Aluminum electroplating on steel from a fused bromide electrolyteTRIPATHY, Prabhat K; WURTH, Laura A; DUFEK, Eric J et al.Surface & coatings technology. 2014, Vol 258, pp 652-663, issn 0257-8972, 12 p.Article

Types and characteristics of precious metal plating bathsKITADA, Katsutsugu.Hyomen gijutsu. 2004, Vol 55, Num 10, pp 626-629, issn 0915-1869, 4 p.Article

Recyclage des bains chromiques : le procédé Chromapur® sur le site de Trédi HombourgGalvano organo traitements de surface. 2003, Num 733, pp 632-635, issn 0982-7870, 4 p.Article

Kerbirio choisit le zinc sans cyanure = Kerbirio choice zinc plating without cyanideGalvano organo traitements de surface. 1991, Vol 60, Num 614, pp 235-238, issn 0982-7870, 4 p.Article

Process control in tin and tin-lead plating of contactsHURLEY, M; LOVIE, J; MISCIOSCIO, K et al.Electronic manufacturing. 1990, Vol 36, Num 1, pp 12-15, 4 p.Article

Waste treatment process for electroless copperHOLLY, J. D.Plating and surface finishing. 1991, Vol 78, Num 1, pp 24-27, issn 0360-3164, 4 p.Article

Autocatalytic deposition of Ni-TM-P alloysGONZALEZ, O. M; WHITE, R. E; COCKE, D. L et al.Plating and surface finishing. 1990, Vol 77, Num 11, pp 63-67, issn 0360-3164, 5 p.Article

Analysis of chromium plating solutions and wastewaters by ion chromatographySHAWN HEBERLING, S; CAMPBELL, D; CARSON, S et al.Plating and surface finishing. 1990, Vol 77, Num 11, pp 58-62, issn 0360-3164, 5 p.Article

Dossier contrôle-mesure = Inspection-measurement documentationGalvano organo traitements de surface. 1990, Num 607, pp 525-577, issn 0982-7870, 35 p.Article

Phosphorus speciation in nickel plating baths by ion chromatographyBIESAGA, M; TROJANOWICZ, M.Journal of chromatography. A. 1995, Vol 705, Num 2, pp 390-395Article

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor AdditivesHAI, Nguyen T. M; ODERMATT, Jan; GRIMAUDO, Valentine et al.Journal of physical chemistry. C. 2012, Vol 116, Num 12, pp 6913-6924, issn 1932-7447, 12 p.Article

Three-additive model of superfilling of copperYANG CAO; TAEPHAISITPHONGSE, Premratn; CHALUPA, Radek et al.Journal of the Electrochemical Society. 2001, Vol 148, Num 7, pp C466-C472, issn 0013-4651Article

Evaluation of Selective Separation of Phosphorous Components from Plating Baths Using SchwertmanniteOKIDO, Masazumi; TAKAKUWA, Toshihiro; ESKANDARPOUR, Akbar et al.ISIJ international. 2008, Vol 48, Num 5, pp 685-689, issn 0915-1559, 5 p.Article

Electroless cobalt bath-life extensionHONMA, H; NOGUCHI, M.Plating and surface finishing. 1990, Vol 77, Num 12, pp 67-70, issn 0360-3164, 4 p.Article

Substrate-catalyzed electroless gold platingIACOVANGELO, C. D; ZARNOCH, K. P.Journal of the Electrochemical Society. 1991, Vol 138, Num 4, pp 983-988, issn 0013-4651, 6 p.Article

Autocatalytic electroless gold deposition using hydrazine and dimethylamine borane as reducing agentsIACOVANGELO, C. D.Journal of the Electrochemical Society. 1991, Vol 138, Num 4, pp 976-982, issn 0013-4651, 7 p.Article

Ammonium chloride makes good sense for chloride zinc platersROSENBERG, W. E; HOLLAND, F. H.Plating and surface finishing. 1991, Vol 78, Num 1, pp 51-53, issn 0360-3164, 3 p.Article

Effects of deposition temperature on the performance of CdS films with chemical bath depositionLIMEI ZHOU; XIAOFEI HU; SUMEI WU et al.Surface & coatings technology. 2013, Vol 228, issn 0257-8972, S171-S174, SUP1Conference Paper

Optimized bath for electroless deposition of palladium on amorphous alumina membranesVOLPE, Maurizio; INGUANTA, Rosalinda; PIAZZA, Salvatore et al.Surface & coatings technology. 2006, Vol 200, Num 20-21, pp 5800-5806, issn 0257-8972, 7 p.Article

Characteristics of non - cyanide acid zinc plating baths and coatingsCHANDRAN, M; LEKSHMANA SARMA, R; KRISHNAN, R. M et al.Transactions of the Institute of Metal Finishing. 2003, Vol 81, pp 207-209, issn 0020-2967, 3 p., 6Article

The influence of 2,2'-dipyridyl on non-formaldehyde electroless copper platingJUN LI; HAYDEN, Harley; KOHL, Paul A et al.Proceedings - Electrochemical Society. 2003, pp 99-111, issn 0161-6374, isbn 1-56677-390-3, 13 p.Conference Paper

Purification of hard chromium plating baths: Options & challengesDONEPUDI, V. S; KHALILI, N. R; KIZILEL, R et al.Plating and surface finishing. 2002, Vol 89, Num 4, pp 62-65, issn 0360-3164Article